The thermal expansion coefficient of epoxy/inorganic additives composites was controlled by changing the amount of the inorganic additives such as talc and fused silica. The epoxy resin comprises hydrogenated bisphenol A (HBA)-based epoxide, difunctional polyglycidyl epoxide (DPE) as a diluent and isophorone-diamine (IPDA) as a crosslinking agent, which was subsequently mixed with inorganic additives (talc and fused silica). The thermal expansion coefficient was decreased by increasing amount of inorganic additives, nearly to fresh granite. Fused silica was more effective than talc in lowering the thermal expansion coefficient. Additionally, flexural and tensile strengths of the composites were getting lower and higher with the amount of the inorganic fillers, respectively. It was thus concluded that an epoxy composite containing inorganic fillers was developed to show much lower thermal expansion coefficient, similar to fresh granite, than the neat epoxy resin, and also proper mechanical strengths for applications.